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Makr Microsystems Raises ₹10.2 Crore to Help Chipmakers See Hidden Defects Beneath Semiconductor Surfaces

Bengaluru-based semiconductor metrology startup Makr Microsystems has raised ₹10.2 crore in a seed round led by Bluehill VC, building technology to inspect hidden defects beneath chip surfaces without damaging them.

By Aravind Kumar · Author7 September 2026New
Makr Microsystems Raises ₹10.2 Crore to Help Chipmakers See Hidden Defects Beneath Semiconductor Surfaces

Makr Microsystems, a Bengaluru-based semiconductor metrology startup, has raised ₹10.2 crore in a seed funding round led by frontier-tech venture capital firm Bluehill VC, with participation from Artha Venture Fund, according to a report published by Entrackr.

Founded by Ashwin Lal, Makr Microsystems is developing nanoscale 3D subsurface metrology technology designed to help chipmakers see and measure hidden structures and defects beneath semiconductor surfaces without damaging the chip — a capability that combines Acoustic Atomic Force Microscopy (AAFM), optical tomography and 3D data analytics into a single inspection platform.

The proceeds from the round will be directed toward continued technology development, customer validation, and commercialization of Makr's metrology solutions, with initial target applications including advanced packaging, hybrid bonding, buried interfaces, chiplet interconnects and defect detection.

As semiconductor architectures move increasingly into the third dimension — through advanced packaging, chiplets and 3D chip designs — much of what determines a chip's quality and yield now lies buried beneath layers of material, invisible to conventional surface-level inspection tools. Being able to see and measure these hidden structures matters significantly, since it helps manufacturers understand how a chip was actually built, catch defects early, and ultimately improve production yield.

Semiconductor manufacturing is creating structures that are increasingly difficult to see and measure. Our goal is to make the subsurface measurable, non-destructively and at the resolution the next generation of chipmaking demands.
Ashwin Lal, Founder, Makr Microsystems
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"Semiconductor manufacturing is creating structures that are increasingly difficult to see and measure," said Ashwin Lal, founder of Makr Microsystems. "As architectures move into the third dimension, understanding what is happening beneath the surface becomes critical to improving yield. Our goal is to make the subsurface measurable, non-destructively and at the resolution the next generation of chipmaking demands."

Lal holds a Master's degree in Physics from IIT Kanpur and a PhD in Microtechnology from EPFL, and previously founded Shilps Sciences before working as an engineer at Applied Materials, one of the world's largest semiconductor equipment manufacturers — a background that positions him closely to the specific inspection and yield challenges Makr is now building tools to address.

Bluehill VC, which led the round, has said its investment reflects a broader focus on backing deeptech companies working on complex challenges across critical technology sectors; the firm recently closed its maiden fund at ₹400 crore, giving it fresh capital to deploy into early-stage Indian deeptech and hardware startups such as Makr.

The funding adds Makr Microsystems to a small but growing cluster of Indian startups building semiconductor equipment and metrology tools domestically, at a moment when India is investing heavily in developing an indigenous chip manufacturing ecosystem, spanning fabrication, packaging and the specialized equipment needed to support both.

For Makr Microsystems, the funding marks a step toward developing semiconductor equipment and technology built in India for global markets, positioning the company within a strategically significant, if highly specialized, segment of the chip value chain that has historically been dominated by a small number of large international equipment makers.

TagsMakr MicrosystemsSemiconductorDeeptechIndiaFundingMetrologyChipmaking

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