San Francisco-based legal AI company Harvey has raised $550 million in a growth financing round backed by Sequoia, Andreessen Horowitz, Kleiner Perkins, Coatue and Goldman Sachs Alternatives, pushing its total disclosed funding above $1.55 billion.
Jio Payment Solutions and employee-benefits platform Pluxee made fresh moves in India's crowded digital payments landscape, underscoring the continued intensity of competition across the sector.
IT services major Wipro has launched a Chief Information Security Officer Command Center in collaboration with cybersecurity firm CrowdStrike, aimed at helping enterprise clients shift from fragmented, tool-driven security operations toward integrated, outcome-based defence.
Ride-hailing giant Uber has invested a further $10 million in Gurugram-based fleet and mobility technology startup Carrum Mobility, its second bet on the company this year, valuing it at roughly Rs 1,600 crore.
Bengaluru-based QNu Labs has raised Rs 200 crore in a Series A1 round co-led by India's National Quantum Mission and Speciale Invest, alongside a separate Rs 150 crore convertible facility, to expand its quantum-safe encryption business globally.
Arm has introduced its next-generation Neoverse CSS N4 platform, code-named Ranger, offering configurations from eight to 128 CPU cores per die to give cloud and AI infrastructure designers a customisable silicon foundation.
French AI startup Mistral AI has raised EUR 3 billion in a Series D round led by Samsung at a EUR 21 billion valuation, ranking among the largest private technology funding rounds ever completed in Europe.
Alphabet's Google has rolled out redesigned search results across Europe to comply with the Digital Markets Act, warning the changes represent the largest reduction in Search quality in the product's history.
OpenAI has signed a multiyear agreement with Nvidia-backed infrastructure operator Firmus to secure AI computing capacity from two data centres in Malaysia, extending its infrastructure footprint into Southeast Asia.
ASML is working with TSMC, Intel Foundry and Samsung to move High-NA EUV lithography from 6-inch to 12-inch photomasks, a shift expected to lift system productivity by roughly 40% for next-generation AI chips.